FUJIFILM Diosynth Biotechnologies (FDB) will be hosting a Science Exchange Pitch Event on 3rd April 2019 in Cambridge, MA. 

The FUJIFILM Diosynth Biotechnologies (FDB) Science Exchange Pitch Event provides an opportunity for small and medium-sized businesses, spin-outs and academics to meet key FDB personnel and find out more about their Science and Innovation strategy, and the way they work with external organisations.

During this event, participants are invited to pitch their technology-driven products, services and processes to an audience of biopharma professionals, sharing knowledge and stimulating conversation. This is a great opportunity for potential new collaborative partnerships to be formed, new contacts to be made, and to discover technologies that other businesses are developing.

Attendees are expected to deliver a 6-minute pitch about their organisation’s services and/or research expertise. Each pitch will comprise a maximum of 6 slides. There will then be 6 minutes for questions after each pitch.

Who should apply?

FDB are particularly interested in hearing from companies who have technology and expertise in:

  • DRY SCIENCE:¬†to use automation, robotics and predictive technologies to reduce the amount of wet, bench science required to meet project objectives
  • MANUFACTURING 2.0 -¬†to develop next generation manufacturing & testing technologies using smaller, more flexible, more automated facilities that are aligned across sites
  • NEW BIOLOGY -¬†to support emerging product types, synthetic manufacture and step out science

Further information

FUJIFILM Diosynth Biotechnologies (FDB) provides process development and manufacturing services to the biopharmaceutical industry. The FDB Science Exchange is part of their Science and Innovation Strategy, designed to promote and direct change beyond FDB by sharing expertise, resources and know-how with the external scientific community.

You can apply to take part in the FDB Science Exchange here.

The closing date for applications is 3rd March 2019.

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